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- Artículo no. SW11309
- Product Code: ICD24CTC
- Fabricante no.: ICD24CTC
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IC Diamond ® Thermal CompoundIC
Diamond is truly an outstanding thermal product with the combined attributes of ultra-high performance and high durability. IC Diamond loads 3X-4X longer than your typical retail compound. On independent tests and reviews by over 900 over clockers on 24 websites, IC Diamond out performed all previously installed user compounds.
Eleven PC Hardware sites conducted competitive comparisons of thermal compound performance. All comparisons highlight IC Diamond thermal paste's top tier performance characteristicsApplications
IC Packaging Heat Conduction Battery
Thermal Management LED Lighting Thermal
Management Heatsink-Thermal Interface-Non BondingInnovation
Cooling provides custom repackaging services
for our commercial customers - Inquire hereData Sheet:I
C Diamond 7 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heat sink by taking advantage of diamond's superior thermal conductivity.
Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver.
Diamond's five times better thermal conductivity compared to silver makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and non-capacitive.
of IC Diamond Thermal grease contains 7 carats of micronized diamond with diamond particle loadings @ 92% by weight.
Material loading above 90% is recommended as the best combination of rheological and thermal properties to minimize interface pump out due to thermal cycling.
Superior bulk conductivity Excellent thermal impedanceT
ight particle distributions < 40 µ maximum
ilicone free Lower viscosity
Greater stability Non capacitive or electrically
IC Diamond requires minimal time to attain peak performance; in most cases, IC Diamond will reach peak performance after two hours of use. *Stability
: IC Diamond is designed for stability - it will not bleed or separate in normal use.
Conductance: 4.5 W/m-K (data acquired with an ASTM D - 5470 thermal interface test instrument)Thermal
Resistance: 0.25oC-cm2/W@ 100 µ BLTAverage
Particle Size: <40 µ maximum particle diameterCompliancy:
Cure Time Assumes an optimized pressure of 50 PSI Lighter load pressures will increase cure times to a week or more