inkl. MwSt. zzgl. Versandkosten
Lieferzeit ca. 3-5 Werktage
Ratenzahlung verfügbar zwischen 99€ und 5000€ Warenwert
Produkt-Vorteile im Überblick
- Notebook Configurator
- Tested and Verified
- Authorized Service & Lifetime Support
- Free Shipping by Bank Transfer
- Artikel-Nr.: SW11309
- Product Code: ICD24CTC
Wir versenden mit:
IC Diamond ® Thermal Compound
IC Diamond is truly an outstanding thermal product with the combined attributes of ultra-high performance and high durability. IC Diamond lasts 3X-4X longer than your typical retail compound. On independent tests and reviews by over 900 over clockers on 24 websites, IC Diamond out performed all previously installed user compounds.
Eleven PC Hardware sites conducted competitive comparisons of thermal compound performance. All comparisons highlight IC Diamond thermal paste’s top tier performance characteristics
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IC Diamond 7 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heat sink by taking advantage of diamond’s superior thermal conductivity.
Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver.
Diamond’s five times better thermal conductivity compared to silver makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and non-capacitive.
Each tube of IC Diamond Thermal grease contains 7 carats of micronized diamond with diamond particle loadings @ 92% by weight. Material loading above 90% is recommended as the best combination of rheological and thermal properties to minimize interface pump out due to thermal cycling.
Superior bulk conductivity
Excellent thermal impedance
Tight particle distributions
< 40 µ maximum particle diameter
Non capacitive or electrically conductive
Curing Time: IC Diamond requires minimal time to attain peak performance; in most cases, IC Diamond will reach peak performance after two hours of use. *
Stability: IC Diamond is designed for stability – it will not bleed or separate in normal use.
Thermal Conductance: 4.5 W/m-K (data acquired with an ASTM D – 5470 thermal interface test instrument)
Thermal Resistance: 0.25oC-cm2/W@ 100 µ BLT
Average Particle Size: <40 µ maximum particle diameter
Compliancy: RoHS Compliant.
Note* Cure Time Assumes an optimized pressure of 50 PSI Lighter load pressures will increase cure times to a week or more